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Lead Free Solder Paste

SIRIUS 1LF is a No-Clean & Lead Free solder paste.

Carefully formulated to solder all surfaces, SIRIUS 1LF leaves a very low volume of clear residues after soldering.This paste is designed to offer a wide process window and reduces solder defects with a minimum increase of temperature compared to lead content products.

Characteristics Alloys Supplied
High speed printing: from 50 to 150 mm/s
Screen life: > 12 hours
Tack life: > 12 hours
Abandon time: up to 12 hours
Very low solder balling.
Clear and very benign residues
Tests and Qualifications include criteria from the
J-STD-004, -005, and -006 specifications
Available under dispensing version and/or RA formulation.		Sn96.5Ag3Cu0.5
Sn95.5Ag3.8Cu0.7
Sn96Ag4		Jars of 250g, 500g
Cartridges of 500g, 1Kg
Proflow® cartridge system
Automatic syringes
30g, 100g, 200g

 

 

Lead Free Alloys

MBO proposes a wide range of lead Free Solder Alloys for electonic industry.
These Alloys meets European RoHS requirements.
"LOW COST" solutions are available with very interresting technical characteristics.

AlloysApplications
Sn95.5Ag3.8Cu0.7Wave soldering 
Sn96.5Ag3Cu0.5
&
Sn97Ag3		Wave soldering 
Sn96.5Ag3.5Wave soldering & selective soldering
Sn99Cu SP
&
Sn100 SP		Wave, selective, dipping "LOW COST"
Sn99CuHTHigh temperature dipping "LOW COST"
Sn99Cu dipping "LOW COST"
Sn97Cu3 Industrial soldering "LOW COST"
 

Lead Free Solder Wires

The new range AUTOFIL solder wires with incorporated flux is available in Lead Free Alloys

From halide free (A0 - R1) to high activated system (A11), this complete range has no-clean properties and let clear and safe residues after soldering.

 A0R1A11
Halideswithoutwithout1.1%
Acid Value250210130
J-STD ClassificationROLOROLOROMI
ApplicationSMT Rework
General Application		SMT Rework
General Application		Connectic on
all substrates
AlloysSn95.5Ag3.8Cu0.7
Sn96.5Ag3Cu0.5
Sn96.5Ag3.5		Sn95.5Ag3.8Cu0.7
Sn96.5Ag3Cu0.5
Sn96.5Ag3.5		Sn95.5Ag3.8Cu0.7
Sn96.5Ag3Cu0.5
Sn96.5Ag3.5
Sn99.3Cu0.7 "LOW COST"

MBO family of no-clean solder wire "AUTOFIL" is carefully formulated to confer high activity soldering on various substrates, including, copper, tin/lead, brass, nickel, etc. Various activations are available to suit most oxidised metallization. MBO "AUTOFIL" range of solder wire confers rapid soldering with copper, tin/lead, brass and nickel.

MBO "AUTOFIL" range of solder wire can be used in conjunction with various methods of soldering, such as soldering iron, hot air, induction, hot plate and blow torch. When used with a soldering iron, it is recommended to use an operating temperature of 370°C.